Product description
• Halogen free, lead free, RoHS compliant
• 125°C maximum total temperature operation
• 11.0 x 8.0 x 7.5mm maximum surface mount package
• Ferrite core material
• Controlled DCR for sensing circuits
• Inductance range from 100nH to 210nH
• Current range from 55 to 100+ amps
Applications
• Multi-phase regulators
• Voltage Regulator Modules (VRMs)
• Desktop and server VRMs and EVRDs
• Notebook regulators
• Data networking and storage systems
• Graphics cards and battery power systems
• Point-of-Load modules
• DCR Sensing circuits
Environmental data
• Storage temperature range (Component): -40°C to +125 °C
• Operating temperature range: -40°C to +125°C (ambient + self-temperature rise)
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape and reel packaging, 500 parts per 13” reel
Product specifications
Product specifications
Part Number | OCL' !nH) .10% | F llmin. 2 !nH) | nsp3 {Alm s} | {Aml t1p4 s} | (AImM2p5 s} | {Alma3p6 s} | 4p7 {Alm s} | DCR (mrl)@200 C | K facto.-s |
FP1108R1-R10-R | 100 | 81 | 65 | 100+ | 96 | 94 | 90 | 0.295% | 330 |
FP1108R1-R15-R | 150 | 110 | 77 | 72 | 66 | 63 | 330 | ||
FP1108R1-R18-R | 180 | 132 | 65 | 61 | 58 | 50 | 330 | ||
FP1108R1-R21-R | 210 | 151 | 55 | 51 | 48 | 45 | 330 |
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, 25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application.
4. Isat1 : Peak current for approximately 20% (R10 10%) rolloff @ +25°C (R10 10%)
5. Isat2: Peak current for approximately 20% (R10 10%) rolloff @ +85°C
6. Isat3 : Peak current for approximately 20% (R10 10%) rolloff @ +100°C
7. Isat4: Peak current for approximately 20% (R10 10%) rolloff @ +125°C
8. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µH), ∆I (peak to peak ripple current in amps).
9. Part Number Definition: FP1108Rx-yyy-R
- FP1108Rx = Product code and size
- Rx = DCR indicator
- yyy= Inductance value in µH
- “-R” suffix = RoHS compliant
Dimensions - mm
Dimensions - mm
DCR measured from point “A” to point “B”
Part marking: FP1108R1 (Product code and size), xxx = Inductance value in µH, wwllyy= date code, R= revision level
Tolerances are ±0.15 millimeters unless stated otherwise
PCB tolerances are ±0.1millimeters unless otherwise specified.
All soldering surfaces to be be coplanar within 0.1 millimeters.
Termination finish: matte Sn with Ni underplate
Packaging information - mm
Temperature rise vs. total loss
Core loss
Inductance characteristics
Solder reflow profile
Reference JDEC J-STD-020D
Packaging information - mm
Temperature rise vs. total loss
Core loss
Inductance characteristics
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature | Standard SnPb Solder | Lead (Pb) Free Solder | |
Preheat and Soak | • Temperature min. (Tsminl | 100°C | 150 °C |
• Temperature max. (Tsmax) | 150 °C | 200 °C | |
• Time (Tsmin to Tsmax) tts) | 60-120 Seconds | 60-120 Seconds | |
Average ramp up rate Tsmax to Tp | 3 C/ Second Max. | 3 C/ Second Max. | |
Liquidous temperatureσL) Time at liquidous (tL) |
183 °C 60-150 Seconds | 217 °C 60-150 Seconds | |
Peak package body temperature (TP)* | Table 1 | Table 2 | |
Time (tp) within 5 °C of the specified classification temperatureσc) | 20 Seconds | 30 Seconds | |
Average ramp-down rateσP to Tsmax) | 6 C/Second Max. | 6 C/ Second Max. | |
Time 25°C to Peak Temperature | 6 Minutes Max. | 8 Minutes Max. |
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.