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FP1108 Series High Frequency High Current Power Inductors

  

Product description
Halogen free, lead free, RoHS compliant
125°C maximum total temperature operation
11.0 x 8.0 x 7.5mm maximum surface mount package
Ferrite core material
Controlled DCR for sensing circuits
Inductance range from 100nH to 210nH
Current range from 55 to 100+ amps
 
Applications
Multi-phase regulators
Voltage Regulator Modules (VRMs)
Desktop and server VRMs and EVRDs
Notebook regulators
Data networking and storage systems
Graphics cards and battery power systems
Point-of-Load modules
DCR Sensing circuits
 
Environmental data
Storage temperature range (Component): -40°C to +125 °C
Operating temperature range: -40°C to +125°C (ambient + self-temperature rise)
Solder reflow temperature: J-STD-020D compliant
 
Packaging
Supplied in tape and reel packaging, 500 parts per 13” reel

Product specifications
Part Number OCL' !nH) .10% F llmin. 2 !nH) nsp3 {Alm   s} {Aml t1p4 s} (AImM2p5 s} {Alma3p6 s} 4p7 {Alm  s} DCR (mrl)@200 C K facto.-s
FP1108R1-R10-R 100 81 65 100+ 96 94 90 0.295% 330
FP1108R1-R15-R 150 110 77 72 66 63 330
FP1108R1-R18-R 180 132 65 61 58 50 330
FP1108R1-R21-R 210 151 55 51 48 45 330
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, 25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application.
4. Isat1 : Peak current for approximately 20% (R10 10%) rolloff @ +25°C (R10 10%)
5. Isat2: Peak current for approximately 20% (R10 10%) rolloff @ +85°C
6. Isat3 : Peak current for approximately 20% (R10 10%) rolloff @ +100°C
7. Isat4: Peak current for approximately 20% (R10 10%) rolloff @ +125°C
8. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µH), ∆I (peak to peak ripple current in amps).
9. Part Number Definition: FP1108Rx-yyy-R 
- FP1108Rx = Product code and size 
- Rx = DCR indicator 
- yyy= Inductance value in µH 
- “-R” suffix = RoHS compliant

Dimensions - mm

DCR measured from point “A” to point “B”
Part marking: FP1108R1 (Product code and size), xxx = Inductance value in µH, wwllyy= date code, R= revision level
Tolerances are ±0.15 millimeters unless stated otherwise
PCB tolerances are ±0.1millimeters unless otherwise specified.
All soldering surfaces to be be coplanar within 0.1 millimeters.
Termination finish: matte Sn with Ni underplate

Packaging information - mm


Temperature rise vs. total loss


Core loss


Inductance characteristics


Solder reflow profile


Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsminl 100°C 150 °C
• Temperature max. (Tsmax) 150 °C 200 °C
• Time (Tsmin  to Tsmax)  tts) 60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp 3  C/ Second  Max. 3  C/ Second  Max.
Liquidous temperatureσL)
Time at liquidous (tL)
183 °C 60-150 Seconds 217 °C 60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)    within 5 °C of  the specified classification temperatureσc) 20 Seconds 30 Seconds
Average ramp-down rateσP to Tsmax) 6  C/Second  Max. 6  C/ Second  Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

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